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eBook details

• Title: Carbon Nanotubes for Interconnects
• Author : Aida Todri-Sanial, Jean Dijon & Antonio Maffucci
• Release Date : January 09, 2016
• Genre: Electrical Engineering,Books,Professional & Technical,Engineering,Computers & Internet,Computers,
• Pages : * pages
• Size : 9684 KB

Description

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects.  The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications.  Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry.  This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Provides a single-source reference on carbon nanotubes for interconnect applications;Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects;Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.

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